Krailling, Germany—Lasers used for microprocessing are now being successfully used in making prototypes of printed circuit boards. Units used in numerous applications in the electronics and semiconductor industries have been adjusted so that typical processing steps in the manufacture of boards, including micro-via drilling, direct structuring of metallic and organic layers, creation of ultra-fine conductor structures, and laser cutting of flexible, rigid, and thin multilayers, can be reliably carried out in a single operating cycle.
Typical of these new laser processors is the ILS500P from Innolas GmbH—a processing center powered by an ultraviolet (355 nm) solid-state laser with an average output power of 7 W and a pulse repetition rate of 100 kHz. With an option of integrating a second laser, such as a CO2 unit, to process ceramic circuit boards, this unit is well positioned to make prototypes as well as manufacturing boards on a variety of substrates and for quickly switching circuits, particularly in high-frequency circuits.
For more information on the ILS500P access the company's Web site www.innolas.de.
